THE Datasheet(PDF) - DAP4119 - BRIGHT LED ELECTRONICS CORP

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THE Datasheet, PDF

: ALL 3M Electronics(6)3PEAK INC.(1)A-BRIGHT Inc(4)A-Data Technology(3)A1 PROs co., Ltd.(1)AAEON Technology(6)ABB(2)Abracon Corporation(5)ACE Technology Co., LTD.(2)ADTech(6)Advanced Crystal Technology(6)Advanced Linear Devices(1)Advanced Micro Devices(5)Advanced Photonix, Inc.(29)Advanced Power Electronics Corp.(1)Advanced Power Technology(37)Advanced Semiconductor(2)Advanced Semiconductor Business Inc.(1)Advanced Thermal Solutions, Inc.(2)Advantech Co., Ltd.(5)AEL Crystals Ltd(1)Aeroflex Circuit Technology(1)Agere Systems(2)Agilent(Hewlett-Packard)(11)AiT Semiconductor Inc.(1)Allegro MicroSystems(64)Alliance Semiconductor Corporation(1)Alpha & Omega Semiconductors(3)Alpha Wire(13)ALPS ELECTRIC CO.,LTD.(10)Altera Corporation(19)America Semiconductor, LLC(1)Amkor Technology(3)Amphenol Corporation(15)Ampleon Netherlands B.V.(1)ANADIGICS, Inc(2)Analog Devices(90)Analog Intergrations Corporation(1)Anaren Microwave(36)Anderson Power Products, Inc.(1)Anpec Electronics Coropration(1)Apacer Technology Inc.(6)Applied Concepts Inc.(1)Arch Electronics Corp.(1)Aries Electronics, Inc.(5)Artesyn Technologies(5)Asahi Kasei Microsystems(3)ASM GmbH(1)Astec America, Inc(4)ATMEL Corporation(50)ATTEND Technology Inc.(26)AU Optronics Corp.,(1)AUK corp(1)AVAGO TECHNOLOGIES LIMITED(34)Aven, Inc.(1)AVX Corporation(27)Axiomtek Co., Ltd.(1)AZ Displays(3)Beckhoff Automation GmbH & Co. KG(9)Bel Fuse Inc.(3)Belden Inc.(2)Bellnix Co.,Ltd.(4)BEYONDINFINITE(1)Bi technologies(18)Bourns Electronic Solutions(5)BRIGHT LED ELECTRONICS CORP(10)Broadcom Corporation.(4)Bruckewell Technology LTD(3)Burr-Brown (TI)(1)BusBoard Prototype Systems Ltd.(6)C&K Components(1)California Eastern Labs(4)California Micro Devices Corp(1)Calogic, LLC(1)Catalyst Semiconductor(1)Central Semiconductor Corp(32)Ceramate Technical(1)Cherry Semiconductor Corporation(6)Cirrus Logic(10)CITIZEN ELECTRONICS CO., LTD.(161)CML Microcircuits(56)Coilcraft lnc.(2)Communications & Power Industries, Inc.(12)Connor-Winfield Corporation(1)Cooper Bussmann, Inc.(6)Cornell Dubilier Electronics(7)COSMO Electronics Corporation(1)Crydom Inc.,(1)Crystalfontz America, Inc.(1)CRYSTEK CORPORATION(17)Cymbet Corporation(9)Cynergy3 Co(2)Cyntec Co., Ltd.(16)Cypress Semiconductor(15)Daewoo Semiconductor(1)Danisense A/S(1)Datatronic Distribution, Inc.(1)DB Lectro Inc(3)DDK Ltd.(1)Delta Electronics, Inc.(800)Dialight Corporation(1)Dialog Semiconductor(2)Dielectric Laboratories, Inc.(1)Digital Core Design(1)Digital View Ltd(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(24)DIYI Electronic Technology Co., Ltd.(1)DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD(3)E&E Magnetic Products Limited(1)E-SWITCH(63)E-Tech Electronics LTD(114)Eaton All Rights Reserved.(2)ECS, Inc.(64)EDA Technology Co.,LTD(1)ELATEC GmbH(1)ELMOS Semiconductor AG(3)EM Microelectronic - MARIN SA(3)Emerson Network Power(3)Endress+Hauser Group Services AG(10)Enpirion, Inc.(1)EPCOS(1)Epson Company(2)Ericsson(1)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(5)Espros Photonics corp(1)Estek Electronics Co. Ltd(6)ETA-USA(1)ETAL Group(18)Etron Technology, Inc.(2)Everlight Electronics Co., Ltd(11)Exar Corporation(10)EXCEL CELL ELECTRONIC CO., LTD.(2)Extech Instruments Corporation.(7)
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Searched Keyword : 'THE' - Total: 10 (1/1) Pages

Manufacturer	Part #	Datasheet	Description
BRIGHT LED ELECTRONICS ...	DAP4119	1Mb/20P	THE GLOBAL EXPERT IN SOLID STATE RELAY TECHNOLOGY
	BM-41EG57MD	413Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG88MD	596Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG57MD	357Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG57ND	305Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-20EG57ND	411Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG58MD	482Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG88ND	742Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-41EG57ND	736Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
	BM-10EG88MD	488Kb/3P	hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.

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