CHIP Datasheet(PDF) - HT1MOA3S30 - NXP Semiconductors

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CHIP Datasheet, PDF

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Searched Keyword : 'CHIP' - Total: 106 (1/6) Pages

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	HT1MOA3S30	156Kb/24P	HITAGTM1 Chip Module August 1997
	HT2MOA3S20	161Kb/22P	HITAGTM2 Chip Module August 1997 Revision 1.1
	HTRC11001T	94Kb/20P	HITAG reader chip 2001 Nov 23
	RC01	80Kb/11P	Standard chip resistors 1997 Feb 26
	PNX8510	2Mb/92P	Analog companion chip Rev. 04??2 January 2004
	PCA9504A	146Kb/29P	Glue chip 4 2004 May 11
	80C851	182Kb/22P	CMOS single-chip 8-bit microcontroller with on-chip EEPROM 1998 Jul 03
	SAA7811HL	86Kb/20P	Single-chip DVD-ROM 1999 Oct 05
	SA56202	117Kb/24P	One-chip motor driver Rev. 01-19 July 2004
	TEA5551T	160Kb/17P	1-chip AM radio October 1990
	P83C557E6	341Kb/64P	Single-chip 8-bit microcontroller 1999 Mar 02
	TEA5767	382Kb/2P	single-chip FM stereo radio March 2002
	80C552	185Kb/23P	Single-chip 8-bit microcontroller 2002 Sep 03
	83C552	188Kb/24P	Single-chip 8-bit microcontroller 1998 Aug 13
	SL1MOA2S30	34Kb/7P	Contactless Chip Card Module Specification July 2001
	CARD_74LVC1GX04	97Kb/2P	One chip crystal oscillator driver August 2003
	PCD6003	385Kb/96P	Digital telephone answering machine chip 2001 Apr 17
	XA-H4	225Kb/42P	Single-chip 16-bit microcontroller 1999 Sep 24
	PCD6001	385Kb/96P	Digital telephone answering machine chip 2001 Apr 17
	P83C557E4	374Kb/72P	Single-chip 8-bit microcontroller 1999 Mar 02

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What is CHIP

Electronic component chip usually refers to an integrated circuit chip (IC chip).

This is an electronic component made by integrating various electronic devices (transistors, resistance, condenser, diode, etc.) on a small silicone disc.

Such IC Chip is used as an essential component in Hyundai Electronics products and is applied to various products such as computers, mobile phones, digital cameras, automobiles and home appliances.

The invention of IC Chip has revolutionized the electronic industry, and has made various innovative developments such as miniaturization of electronic components, increasing integration, and reducing power consumption.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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