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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (8/50) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Kepont Electronics, Inc...
KEST-481BW Datasheet pdf image
188Kb/1P
Ball Bearing
Company Logo Img
Festo Corporation.
4405648 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4405686 Datasheet pdf image
86Kb/2P
Ball valve
11/23/21
4405691 Datasheet pdf image
86Kb/2P
Ball valve
11/23/21
9545 Datasheet pdf image
80Kb/2P
Ball valve
4/15/22
8096943 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
8096951 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
1686641 Datasheet pdf image
97Kb/2P
Ball valve
7/8/22
1692211 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
534303 Datasheet pdf image
98Kb/2P
Ball valve
7/7/22
534304 Datasheet pdf image
98Kb/2P
Ball valve
7/7/22
534308 Datasheet pdf image
98Kb/2P
Ball valve
7/7/22
1692220 Datasheet pdf image
100Kb/2P
Ball valve
7/8/22
1692224 Datasheet pdf image
100Kb/2P
Ball valve
7/8/22
1692230 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
1692204 Datasheet pdf image
87Kb/2P
Ball valve
11/22/21
1692206 Datasheet pdf image
87Kb/2P
Ball valve
11/22/21
4405647 Datasheet pdf image
95Kb/2P
Ball valve
11/23/21
4451864 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4762850 Datasheet pdf image
97Kb/2P
Ball valve
11/23/21

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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