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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (6/50) Pages
ManufacturerPart #DatasheetDescription
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Festo Corporation.
4405687 Datasheet pdf image
87Kb/2P
Ball valve
11/23/21
4802248 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
4810855 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4451859 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4795668 Datasheet pdf image
101Kb/2P
Ball valve
11/23/21
9542 Datasheet pdf image
82Kb/2P
Ball valve
4/15/22
9544 Datasheet pdf image
81Kb/2P
Ball valve
4/15/22
4745215 Datasheet pdf image
83Kb/2P
Ball valve
6/30/22
4745218 Datasheet pdf image
84Kb/2P
Ball valve
6/30/22
4745220 Datasheet pdf image
83Kb/2P
Ball valve
6/30/22
4809118 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
4809123 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
4836918 Datasheet pdf image
95Kb/2P
Ball valve
6/30/22
8089039 Datasheet pdf image
98Kb/2P
Ball valve
6/30/22
8089057 Datasheet pdf image
87Kb/2P
Ball valve
6/30/22
8089059 Datasheet pdf image
87Kb/2P
Ball valve
6/30/22
8096664 Datasheet pdf image
85Kb/2P
Ball valve
6/30/22
8096665 Datasheet pdf image
85Kb/2P
Ball valve
6/30/22
8096666 Datasheet pdf image
85Kb/2P
Ball valve
6/30/22
4834291 Datasheet pdf image
99Kb/2P
Ball valve
7/1/22

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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