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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (5/50) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Festo Corporation.
8096956 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
153484 Datasheet pdf image
95Kb/2P
Ball valve
4/15/22
153487 Datasheet pdf image
87Kb/2P
Ball valve
4/15/22
8089038 Datasheet pdf image
98Kb/2P
Ball valve
6/30/22
8089045 Datasheet pdf image
96Kb/2P
Ball valve
6/30/22
8089056 Datasheet pdf image
87Kb/2P
Ball valve
6/30/22
8096667 Datasheet pdf image
85Kb/2P
Ball valve
6/30/22
4834301 Datasheet pdf image
100Kb/2P
Ball valve
7/1/22
4834303 Datasheet pdf image
100Kb/2P
Ball valve
7/1/22
8096671 Datasheet pdf image
84Kb/2P
Ball valve
7/1/22
8096948 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
1686699 Datasheet pdf image
97Kb/2P
Ball valve
7/8/22
Company Logo Img
Kepont Electronics, Inc...
KEST-481BT Datasheet pdf image
188Kb/1P
Ball Bearing
Company Logo Img
List of Unclassifed Man...
0030 Datasheet pdf image
69Kb/1P
BALL KNOB
0033-F Datasheet pdf image
68Kb/1P
BALL KNOB
Company Logo Img
Festo Corporation.
1692207 Datasheet pdf image
88Kb/2P
Ball valve
11/22/21
4405651 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4451854 Datasheet pdf image
107Kb/2P
Ball valve
11/23/21
9543 Datasheet pdf image
81Kb/2P
Ball valve
4/15/22
1692208 Datasheet pdf image
91Kb/2P
Ball valve
11/22/21

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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