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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (4/50) Pages
ManufacturerPart #DatasheetDescription
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Festo Corporation.
4745225 Datasheet pdf image
82Kb/2P
Ball valve
7/1/22
4834288 Datasheet pdf image
99Kb/2P
Ball valve
7/1/22
4834293 Datasheet pdf image
100Kb/2P
Ball valve
7/1/22
4834294 Datasheet pdf image
100Kb/2P
Ball valve
7/1/22
4834298 Datasheet pdf image
100Kb/2P
Ball valve
7/1/22
1686625 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
1686640 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
1686705 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
1692210 Datasheet pdf image
100Kb/2P
Ball valve
7/8/22
1692214 Datasheet pdf image
100Kb/2P
Ball valve
7/8/22
1692229 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
4802245 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
4810854 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4451869 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
4762851 Datasheet pdf image
96Kb/2P
Ball valve
11/23/21
4783599 Datasheet pdf image
97Kb/2P
Ball valve
11/23/21
4802244 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
8097474 Datasheet pdf image
84Kb/2P
Ball valve
11/23/21
8089062 Datasheet pdf image
87Kb/2P
Ball valve
7/1/22
8096946 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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