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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 993 (11/50) Pages
ManufacturerPart #DatasheetDescription
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Festo Corporation.
4783601 Datasheet pdf image
97Kb/2P
Ball valve
11/23/21
4795667 Datasheet pdf image
102Kb/2P
Ball valve
11/23/21
8089064 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
8096673 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
8096954 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
4405649 Datasheet pdf image
94Kb/2P
Ball valve
11/23/21
4405689 Datasheet pdf image
86Kb/2P
Ball valve
11/23/21
4451855 Datasheet pdf image
106Kb/2P
Ball valve
11/23/21
8096944 Datasheet pdf image
86Kb/2P
Ball valve
7/1/22
8096947 Datasheet pdf image
85Kb/2P
Ball valve
7/1/22
1686648 Datasheet pdf image
93Kb/2P
Ball valve
7/8/22
1686665 Datasheet pdf image
96Kb/2P
Ball valve
7/8/22
534305 Datasheet pdf image
97Kb/2P
Ball valve
7/7/22
1692221 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
1692228 Datasheet pdf image
101Kb/2P
Ball valve
7/8/22
4745214 Datasheet pdf image
82Kb/2P
Ball valve
6/30/22
4809122 Datasheet pdf image
97Kb/2P
Ball valve
6/30/22
8089042 Datasheet pdf image
96Kb/2P
Ball valve
6/30/22
8089043 Datasheet pdf image
97Kb/2P
Ball valve
6/30/22
8089048 Datasheet pdf image
98Kb/2P
Ball valve
6/30/22

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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