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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 14 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
List of Unclassifed Man...
0130-A Datasheet pdf image
76Kb/1P
BALL KNOB
0030 Datasheet pdf image
69Kb/1P
BALL KNOB
0033-F Datasheet pdf image
68Kb/1P
BALL KNOB
0035-D Datasheet pdf image
67Kb/1P
BALL KNOB
RB-231X2 Datasheet pdf image
81Kb/1P
ROLLING BALL SENSOR
EFB0424VHD Datasheet pdf image
79Kb/1P
Bearing Type Ball Bearings
1221R1KL Datasheet pdf image
327Kb/2P
SERVO MOUNT / BALL BEARING
B6025 Datasheet pdf image
375Kb/1P
ball bearing or fluid dynamic bearing
OA254AP-11-1WB Datasheet pdf image
86Kb/1P
Operating Temperature Ball Bearing -20C ~ +80C
36962 Datasheet pdf image
350Kb/1P
Metric Ball End Hex Keys Black Finish
36941 Datasheet pdf image
269Kb/1P
Metric Ball End Hex Keys Chrome Finish
MG996R Datasheet pdf image
104Kb/2P
High Torque Metal Gear Dual Ball Bearing Servo
BL1L5NT250ST1 Datasheet pdf image
94Kb/2P
series, ball-grid-array thin film delay lines
FL7B5BH Datasheet pdf image
68Kb/1P
Ball-Grid-Array Thin Film Low-Pass Filter

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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