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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 12 (1/1) Pages
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Alliance Semiconductor ...
AS4C64M16D3A-12BAN Datasheet pdf image
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96 ball FBGA PACKAGE
AS4C128M16D3LA-12BIN Datasheet pdf image
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96 ball FBGA PACKAGE
AS4C8M16D1-5BIN Datasheet pdf image
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60-ball FBGA PACKAGE
AS4C512M8D3A-12BCN Datasheet pdf image
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78 ball FBGA PACKAGE
AS4C64M16D3A Datasheet pdf image
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96 ball FBGA PACKAGE
AS4C32M16MD1A Datasheet pdf image
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60 ball FBGA PACKAGE
AS4C128M16D3LB Datasheet pdf image
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96 ball FBGA PACKAGE
AS4C128M8D3L Datasheet pdf image
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AS4C128M8D3L - 78-ball FBGA PACKAGE
AS4C256M16D3B Datasheet pdf image
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12BCN 96 ball FBGA PACKAGE
AS4C512M8D3L Datasheet pdf image
3Mb/86P
AS4C512M8D3L - 78-ball FBGA PACKAGE
AS4C128M16D3A Datasheet pdf image
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AS4C128M16D3A-12BIN - 96 ball FBGA PACKAGE
AS4C128M16D3B Datasheet pdf image
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2Gb AS4C128M16D3B-12BCN - 96 ball FBGA PACKAGE

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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