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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 3 (1/1) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
STMicroelectronics
M24C64X-FCU Datasheet pdf image
469Kb/35P
64-Kbit serial I짼C bus EEPROM with configurable device address and software write protection, delivered in 4-ball CSP
Rev 7 - September 2019
M24128X-FCU Datasheet pdf image
431Kb/35P
128-Kbit serial I짼C bus EEPROM with configurable device address and software write protection, delivered in 4-ball CSP
Rev 2 - October 2019
M24256X-F Datasheet pdf image
692Kb/42P
256-Kbit serial I²C bus EEPROM with configurable device address and software write protection, delivered in 4-ball WLCSP
Rev 2 - July 2021

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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