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BALL Datasheet, PDF

Searched Keyword : 'BALL' - Total: 21 (1/2) Pages
ManufacturerPart #DatasheetDescription
Company Logo Img
Schneider Electric
VRKP4YYYYY00006 Datasheet pdf image
102Kb/1P
parallel plate with ball pins
Apr 20, 2022
VRKP2YYYYY00002 Datasheet pdf image
84Kb/1P
primary arm with ball pins and indexing bolt
Apr 20, 2022
VRKP4YYYYY00002 Datasheet pdf image
84Kb/1P
primary arm with ball pins and indexing bolt
Apr 20, 2022
VRKP4YYYYY00005 Datasheet pdf image
109Kb/1P
stainless steel parallel plate with bearing and ball pins
Apr 20, 2022
PAS42SBF Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 60 x 60 mm ball screw, lead 16 mm per revolution, ball guide
Apr 20, 2022
PAS44SBD Datasheet pdf image
128Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 110 x 110 mm, ball screw, lead 10 mm per revolution, ball guide
Apr 20, 2022
PAS44SBH Datasheet pdf image
126Kb/5P
Portal axis, Lexium PAS, model range 4, profile size 110 x 110 mm, ball screw, lead 25 mm per revolution, ball guide
Apr 20, 2022
PAS42SBB Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 60 x 60 mm, ball screw, lead 5 mm per revolution, ball guide
Apr 20, 2022
PAS43SBD Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 80 x 80 mm, ball screw, lead 10 mm per revolution, ball guide
Apr 20, 2022
PAS42SBD Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 60 x 60 mm ball screw, lead 10 mm per revolution, ball guide
Apr 20, 2022
PAS43SBB Datasheet pdf image
128Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 80 x 80 mm, ball screw, lead 5 mm per revolution, ball guide
Apr 20, 2022
PAS44SBB Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 110 x 110 mm, ball screw, lead 5 mm per revolution, ball guide
Apr 20, 2022
PAS43SBG Datasheet pdf image
127Kb/6P
Portal axis, Lexium PAS, model range 4, profile size 80 x 80 mm, ball screw, lead 20 mm per revolution, ball guide
Apr 20, 2022
XUZX2003 Datasheet pdf image
98Kb/2P
accessory for sensor - 3D fixing kit - bracket with ball-joint - XUX
CAS42BB Datasheet pdf image
125Kb/5P
Cantilever axis, Lexium CAS, model range 4, profile size 60 x 60 mm, toothed belt, ball guide
Apr 19, 2022
CAS44BB Datasheet pdf image
125Kb/5P
Cantilever axis, Lexium CAS, model range 4, profile size 110 x 110 mm, toothed belt, ball guide
Apr 19, 2022
PAS42BB Datasheet pdf image
135Kb/5P
Portal axis, Lexium PAS, model range 4, profile size 60 x 60 mm, toothed belt, ball guide
Apr 20, 2022
PAS43BB Datasheet pdf image
135Kb/5P
Portal axis, Lexium PAS, model range 4, profile size 80 x 80 mm, toothed belt, ball guide
Apr 20, 2022
CAS43BB Datasheet pdf image
125Kb/5P
Cantilever axis, Lexium CAS, model range 4, profile size 80 x 80 mm, toothed belt, ball guide
Apr 19, 2022
PAS44BB Datasheet pdf image
135Kb/5P
Portal axis, Lexium PAS, model range 4, profile size 110 x 110 mm, toothed belt, ball guide
Apr 19, 2022

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What is BALL


In electronic components, ball is commonly used as a term to describe a component or the shape of a component.

Balls are used in a variety of electronic components and can be used primarily for:

Ball Grid Array (BGA): BGA is one of the electronic component packaging technologies and is used to package chips and other components.

A BGA has a grid pattern made up of small balls, which connect to pads on the circuit board.

BGAs provide high-density connectivity and thermal management, and are one of the most popular packaging technologies in modern electronic devices.

Ball Reducing: Refers to the process of reducing the number of balls in a specific component or part.

This can be used to reduce the size of a component or to save space.

Ball Contact Array (BCA): Ball contact array is a technology that uses balls to make connections between a chip package and a circuit board.

BCAs provide high-density connectivity for power and signaling and are used in high-performance computing and communications systems.

Ball Bond: A process used to connect wires on certain chips or other components.

The ball band is used to hold the wire in a ball and connect the ball to the pad on the circuit board. It is mainly used in high frequency and high voltage applications.

Balls play an important role in the connection and packaging of electronic components, and are used in a variety of technologies and applications.

Therefore, in electronic components, balls are considered as important elements related to connection, packaging, signal transmission, etc.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.


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