Manufacturer | Part # | Datasheet | Description |

Molex Electronics Ltd.
|
0878580751 |
241Kb/5P |
2.00mm (.079 Parallel, 2.54關m (100關 7 Circuits, Lead-free |
0877602618 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 26 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0877602418 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 24 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0877601818 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0878910206 |
770Kb/10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray Packaging, Lead-free |
0877601218 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0877601268 |
103Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, 12 Circuits, 2.54關m (100關) Tin (Sn) over Nickel Plating, Tray, Lead-free |
0877602218 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 22 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0877600818 |
166Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0877603618 |
171Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 36 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0878580750 |
241Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Breakaway Header, Surface Mount, Single Row, Parallel, 2.54關m (100關) Tin (Sn) Plating, without Peg, withKapton Tape |
0879140807 |
3Mb/48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging |
0877601618 |
172Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
0878580550 |
241Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Breakaway Header, Surface Mount, Single Row, Parallel, 2.54關m (100關) Tin (Sn) Plating, without Peg, withKapton Tape |
0878970526 |
1Mb/17P |
2.54mm (.100) Pitch KK짰 Header, Right Angle, Through Hole, Breakaway, 5 Circuits, 2.54關m (100關) Tin (Sn) Plating, without Cap, Tube Packaging, Lead-free |
0878981066 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 10 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free |
0877592083 |
1Mb/14P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 2.54關m (100關) Tin (Sn) Plating, without Peg, Embossed Tape onReel, Lead-free |
0879140806 |
770Kb/11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free |
0878980368 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 3 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free |
0877970040 |
196Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height |