| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0877602618 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 26 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 0878305021 |
125Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Straddle Mount Header, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0901362310 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0905711263 |
286Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.25 關m Gold (Au) |
| 0901362207 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0877602418 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 24 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 0877601818 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 0901362208 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0905711402 |
286Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 40 Circuits, 0.76 關m Gold (Au) |
| 0901362303 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878301221 |
125Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Straddle Mount Header, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0901362330 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0901362312 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878910206 |
770Kb/10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray Packaging, Lead-free |
| 0901220133 |
244Kb/3P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Right Angle, 26 Circuits, 4關m (160關) Tin (Sn) over Nickel (Ni) |
| 0901362204 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0905711642 |
285Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.76 關m Gold (Au) |
| 0905711203 |
293Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 20 Circuits, 0.25 關m Gold (Au) |
| 0905711161 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.1 關m Gold (Au) |
| 0905711142 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 14 Circuits, 0.76 關m Gold (Au) |
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