| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0850132036 |
278Kb/8P |
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1關m (40關") Selective Gold (Au), 48 Circuits, Lead free |
| 0757830122 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.76關m (30關") Gold (Au), SMT Shell, Left Key |
| 0753417474 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416474 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077056 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating |
| 0877583650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 36 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753414447 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077005 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
| 0753414444 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753310447 |
339Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits,1.27關m (50關) Gold (Au) |
| 0757840110 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), SMT Shell, Left Key |
| 0753417747 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753414744 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416764 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416677 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417677 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0757840111 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), SMT Shell, Right Key |
| 0850030294 |
86Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 1關m (40關) Selective Gold (Au), 96 Circuits, Lead free |
| 0757840134 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關") Gold (Au), Through Hole Shell, Right Key |
| 0877156106 |
347Kb/6P |
1.00mm (.039") Pitch, PCI Express* Connector, 64 Circuits, Nylon 6/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關") Gold (Au) Plating |
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