| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0877580450 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0757840119 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Retention Shell, Left Key |
| 0753426777 |
316Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 16 Circuits, 1.27關m (50關) Gold (Au) |
| 0850133122 |
140Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1關m (40關) Selective Gold (Au), 96 Circuits, Lead free |
| 0753417447 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0757840108 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Right Key |
| 0753416466 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753414477 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877584650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 46 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0877584050 |
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 40 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0757830110 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Right Angle, Internal Application36 Circuit, 0.38關m (15關") Gold (Au), SMT Shell, Left Key |
| 0850032983 |
116Kb/4P |
2.54mm (.100") Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole0.25關m (10關") Selective Gold (Au), 32 Circuits, Lead free |
| 0877581250 |
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.38關m(15關") Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0850032763 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole ,0.25關m(10關") Selective Gold (Au), 64 Circuits, Lead free |
| 0753414446 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System,Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753417644 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0850133225 |
136Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1關m (40關) Selective Gold (Au), 64 Circuits, Lead free |
| 0753417766 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417767 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753414474 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
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