| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0736560000 |
355Kb/6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736590002 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關 |
| 0714393164 |
304Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0714393564 |
195Kb/3P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0736561000 |
414Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0714390164 |
325Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0714391564 |
314Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0685620003 |
191Kb/3P |
Serial Attached SCSI (SAS) 4X-to-4X SATA Internal Target Base Cable Assembly, withSideband, 0.76m (2.50 ) Length |
| 0687840003 |
114Kb/2P |
USB Shielded I/O Cable Assembly, USB A-to-Micro-USB B, 2.0m (6.56) LengthBlack, Lead free |
| 0685620002 |
193Kb/3P |
Serial Attached SCSI (SAS) 4X-to-4X SATA Internal Host Base Cable Assembly, withSideband, 0.76m (2.50 ) Length |
| 0740950050 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0740298000 |
237Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Receptacle Power ModuleVertical, 8-Row, 3 Circuits, Gold (Au) Selective 0.76關m (30關") |
| 0736562001 |
409Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736560180 |
399Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76關m (30關") |
| 0743209006 |
108Kb/2P |
MicroCross??DVI-D Digital Visual Interface, PCB Receptacle, Panel Mount, ThroughHole, ATX with Beveled Metal Pins, Right Angle, 0.76關m (30關 |
| 0736560190 |
116Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76關m (30關") |
| 0702800460 |
294Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 84 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0740950055 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0740950046 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 16 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0744410001 |
817Kb/15P |
0.80mm (.031") Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, RightAngle, SMT, 20 Circuits, 0.38關m (15關") Gold (Au) |
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