| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0705430020 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 21Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0714390964 |
325Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Embossed Tape on Reel, 0.76關m (30關") Gold (Au), 64 Circuits Pick |
| 0741621424 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 24 Circuits, 0.8關m (30關") Gold (Au) |
| 0702464004 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 0741620418 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row Shrouded, Version A, High-Temperature, 18 Circuits, 0.8關m (30關") Gold (Au) |
| 0741621232 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 32 Circuits, 0.4關m (15關") Gold (Au) |
| 0741621472 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 72 Circuits, 0.8關m (30關") Gold (Au |
| 0702800462 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 88 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0741621440 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 40 Circuits, 0.8關m (30關") Gold (Au) |
| 0705630021 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 22Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0717640114 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0705430117 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 13Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702800492 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 88 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0702461604 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 0705430111 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 7Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630110 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 6Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702462004 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC Tail Plating |
| 0705630116 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 12Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705430004 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 5Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702800495 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 94 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
English ▼ 
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
