| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0705430008 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 9Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630012 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 13Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630023 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 24Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702475054 |
172Kb/3P |
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC TailPlating |
| 0705630003 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630020 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 21Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702471654 |
172Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.127關m (5關") Gold (Au) Plating, Tin(Sn) PC TailPlating |
| 0676431911 |
180Kb/4P |
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Type A, WhitePolyester, 0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.60mm (.063"), without |
| 0678008062 |
213Kb/4P |
1.27mm (.050") Pitch Serial ATA High Speed Header, Vertical, Through Hole, withLocking Latch, 7 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, for 2.40mm |
| 0678008002 |
213Kb/4P |
1.27mm (.050") Pitch Serial ATA High Speed Header, Vertical, Through Hole, withLocking Latch, 7 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, for 1.60mm |
| 0705430127 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 23Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0676430931 |
180Kb/4P |
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Type A, HighTemperature Black Nylon, 0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.20mm |
| 0714393364 |
195Kb/3P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits Pick and Place Cap |
| 0741620454 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version A, High-Temperature, 54 Circuits, 0.8關m (30關") Gold (Au) |
| 0705430112 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630007 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0741620430 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version A, High-Temperature, 30 Circuits, 0.8關m (30關") Gold (Au) |
| 0741621432 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 32 Circuits, 0.8關m (30關") Gold (Au) |
| 0741621222 |
1Mb/10P |
2.54mm (.100) Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version B, High-Temperature, 22 Circuits, 0.4關m (15關) Gold (Au) |
| 0705630013 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 14Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
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