TOP-OF-RACK Datasheet(PDF) - 23024 - Aries Electronics, Inc.

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TOP-OF-RACK Datasheet, PDF

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Searched Keyword : 'TOP-OF-RACK' - Total: 21 (1/2) Pages

Manufacturer	Part #	Datasheet	Description
Aries Electronics, Inc.	23024	2Mb/3P	Universal Top-Load Socket
	171	659Kb/2P	Combination of Thin, Flexible
	181	545Kb/2P	Combination of Thin, Flexible, Solid Cu Conductors embedded between layers of Tough
	XX-666000-00	501Kb/1P	Allows the use of a narrow package IC in place of a wide one
	800	723Kb/1P	DIP Packaging of LEDs, Incandescent Lamps, DIP Switches
	95-100I25	207Kb/1P	Consult factory for panelized form or for mounting of consigned chips
	96-080M80	200Kb/1P	Consult factory for panelized form or for mounting of con-consigned
	96-100M65	276Kb/1P	Consult factory for panelized form or for mounting of consigned chips
	354000	564Kb/1P	Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts
	351000	702Kb/1P	Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs
	350000-10-HT	613Kb/1P	A cost-effective means of upgrading to SOIC without changing your PCB layout
	350000-11-RC	562Kb/1P	A cost-effective means of upgrading to SOIC without changing your PCB layout
	651000	722Kb/1P	Allows the use of 0.65mm pitch surface-mount ICs in thru-hole designs
	35W000	502Kb/1P	A cost-effective means of upgrading to SOIC without changing your PCB layout
	625	937Kb/1P	Available in either Screw Machine or Coined Contacts in a Variety of Styles
	700	611Kb/1P	Elevated Mounting of LCDs or Other Odd-centered or High Pin-count Components
	MC145158-2	723Kb/1P	A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout
	350000	503Kb/1P	A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout
	450001	483Kb/1P	A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout
	1111841-X	515Kb/1P	A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout

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