| Manufacturer | Part # | Datasheet | Description |

Kingboard Laminates Hol...
|
KB-2150GC |
250Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-3150N |
233Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-2150G |
348Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-2150 |
246Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-3151C |
216Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-3151HS |
218Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-3152 |
231Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-1150 |
288Kb/2P |
Copper-clad phenolic resin paper-based laminate |
| KB-3151S |
212Kb/2P |
Copper-clad phenolic resin paper-based laminate |

List of Unclassifed Man...
|
TIC-4000 |
385Kb/2P |
High Performance Thermal Interface Compound for Copper-Based Heat Sinks |

Microsemi Corporation
|
A3P250-FG256 |
10Mb/220P |
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process |

List of Unclassifed Man...
|
POLYPAD1000 |
455Kb/2P |
Polyester based |

SPANSION
|
S72NS-N |
584Kb/17P |
Based MCPs |
| S71PL-J |
460Kb/24P |
Based MCPs |

List of Unclassifed Man...
|
POLYPADK-10 |
558Kb/2P |
Polyester based |

Amphenol Corporation
|
P-U77-AX11X-XX0X |
337Kb/6P |
COPPER ALLOY |

PHOENIX CONTACT
|
2891161 |
60Kb/5P |
Secure web-based and SNMP-based management |

List of Unclassifed Man...
|
POLYPAD400 |
473Kb/2P |
Polyester based |

Gamewell-FCI by Honeywe...
|
CAB-A |
170Kb/4P |
MULTIPROCESSOR-BASED |

Amphenol Corporation
|
P-U77-AX61M-X071 |
695Kb/10P |
COPPER ALLOY |