BURN- Datasheet(PDF) - HI-8450 - Holt Integrated Circuits

Manufacturer	Part #	Datasheet	Description
Holt Integrated Circuit...	HI-8450	1Mb/11P	Burn-in available
Abracon Corporation	AXS-1147-02-02	419Kb/1P	CRYSTAL TEST & BURN IN SOCKET 08.21.09
AVX Corporation	NOJA106M010RWJ	124Kb/5P	Non-burn safe technology
Abracon Corporation	AXS-7050-06-13	411Kb/1P	CRYSTAL OSCILLATOR TEST & BURN IN SOCKET 07.13.09
	AXS-1155-04-01	410Kb/1P	CRYSTAL TEST & BURN-IN SOCKET 07.10.09
	AXS-2520-04-01	403Kb/1P	CRYSTAL OSCILLATOR TEST & BURN IN SOCKET 07.10.09
	AXS-7550-06-03	412Kb/1P	CRYSTAL OSCILLATOR TEST & BURN IN SOCKET 07.13.09
	AXS-2520-04-05	402Kb/1P	Suitable for high temperature burn-in test 07.10.09
	AXS-2520-04-07	391Kb/1P	Suitable for high temperature burn-in test 07.10.09
Vishay Siliconix	EB4678	202Kb/8P	Edgeboard Connectors 200°C Burn-In Connectors, Dual Readout Revision 14-Aug-02
Abracon Corporation	AXS-5032-04-04	404Kb/1P	Suitable for high temperature burn-in test 07.13.09
Aries Electronics, Inc.	10002	716Kb/1P	High-Temp Universal ZIF DIP Burn-in & Test Socket
	10004HT	1Mb/2P	High-Temp PGA ZIF Test & Burn-in Socket for Footprints on Std 8x8 to 21x21 Grid
	144-PRS12X12-12	841Kb/2P	ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid
	289-PRS17001-12	653Kb/2P	PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid Rev. 1.10
	23026	803Kb/1P	Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	23026HT	844Kb/1P	High-Temp 200째C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

BURN- Datasheet, PDF

Link URL :