BUMPED Datasheet(PDF) - TN0193 - STMicroelectronics

Manufacturer	Part #	Datasheet	Description
STMicroelectronics	TN0193	117Kb/6P	LRIS64K bumped die description
M/A-COM Technology Solu...	MASW-009276-001DIE	290Kb/5P	Bumped GaAs SP3T Switch
	MASW-009590	227Kb/4P	Bumped GaAs SPDT Switch
	MASW-008902-000DIE	308Kb/5P	Bumped GaAs SP3T Switch
	MASW-009590	227Kb/4P	Bumped GaAs SPDT Switch
	MASW-008902-000DIE	308Kb/5P	Bumped GaAs SP3T Switch for WLAN
	MASW-008902-000DIE_V4	308Kb/5P	Bumped GaAs SP3T Switch for WLAN
	MASW-009276-000DIE_V2	275Kb/5P	Bumped GaAs SP3T Switch for WLAN
NXP Semiconductors	MF1ICS2005	90Kb/7P	Sawn bumped 120關m wafer addendum Rev. 3.0 - 18 July 2007
M/A-COM Technology Solu...	MASW-009276-001DIE	889Kb/6P	Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz
	MASW-009276-000DIE	241Kb/5P	Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz
	MASW-008902-000DIE	244Kb/5P	Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz
NXP Semiconductors	SL2ICS20	44Kb/12P	SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification December 2002
Aries Electronics, Inc.	23026	803Kb/1P	Hi-Temp 200째C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	23026HT	844Kb/1P	High-Temp 200째C Test & Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
	24005	1Mb/2P	Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, 關BGA and Bumped Die Devices
Texas Instruments	TLV5614IYZ	666Kb/25P	12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die (Wafer Chip Scale) Package?봒b-Free/Green

BUMPED Datasheet, PDF